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Thermally conductive filler - List of Manufacturers, Suppliers, Companies and Products

Thermally conductive filler Product List

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Thermal Conductive BN (Boron Nitride) Filler 'PolarTherm'

Thermal Conductive BN (Boron Nitride) Filler 'PolarTherm'

Low dielectric constant, excellent electrical insulation, and thermal conductivity thermal conductive BN filler! Improves the lifespan of electronic components and is compatible with 5G and next-generation high-frequency devices.

"PolarTherm" is a thermal conductive filler (discharge filler) that extends the lifespan of electronic components and printed circuit boards through its heat dissipation effect, enhancing reliability. This product is chemically stable and moisture-resistant, featuring high electrical insulation and low dielectric constant. 【Features】 - Contributes to the increased lifespan of electronic components and printed circuit boards - Dielectric constant of 3.9 with low dielectric loss - Choose from over 70 different grades to match your application - High electrical insulation and low dielectric constant - Suitable for heat dissipation materials for EVs and HEVs *For more details, please refer to the PDF catalog. Feel free to contact us with any inquiries.

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"Synthetic Magnesite" [Suitable as a thermal conductivity filler!]

"Synthetic Magnesite" [Suitable as a thermal conductivity filler!]

Magnesium carbonate suitable for thermal conductive fillers! It has a low density and a relatively high thermal conductivity as an inorganic material!

"Magnesite" is a naturally occurring magnesium carbonate. The synthesized magnesite has high purity and high thermal conductivity, making it suitable as a thermal conductive filler. Additionally, it is a soft crystal, which means it causes less wear on molds and other equipment when used as a filler. 【Features】 ■ Low true specific gravity ■ High decomposition temperature ■ Water-resistant ■ Low Mohs hardness ■ Adjustable particle size *For more details, please request materials or view the PDF data from the download section.

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[Research Material] Global Market for Thermal Conductive Fillers

[Research Material] Global Market for Thermal Conductive Fillers

Global Market for Thermal Conductive Fillers: Granular, Flake, Spherical, Fibrous, Aerospace Industry, Electronic Products, Communication Equipment, Automotive Industry

This research report (Global Heat Conducting Filler Market) investigates and analyzes the current state and outlook for the global heat conducting filler market over the next five years. It includes information on the overview of the global heat conducting filler market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include granular, flake, spherical, fibrous, and others, while the segments by application focus on the aerospace industry, electronic products, communication equipment, and the automotive industry. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of heat conducting fillers. It also includes the market share of major companies in the heat conducting filler sector, product and business overviews, and sales performance.

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